My role: Electrical lead on TVR 2026/27 cycle. I own this year's hardware stack and am solely designing four of the five boards.

Boards I am designing:

  • ESC PCB: Dual-channel, 50A-per-channel custom ESC (STM32G0 + AM32) with bidirectional DShot RPM telemetry, six-step commutation, dead-time and shoot-through protection, and integrated battery current/SoC monitoring.

  • Sensor PCB: RTK GPS, UWB, IMU, and LiDAR for precision positioning and height, plus a custom 915 MHz telemetry radio (SX1262) and FPV camera.

  • Backplane PCB: Power distribution and a full battery management system: cell monitoring, voltage / current monitoring, active balancing, and USB-C 100W PD powered in-field charger (charge without disassembling the vehicle).

  • Jetson Carrier (Q3/Q4): Compute module to run high level controls algorithm on the edge (e.g. MPC).

Existing board (Built last year, not my design): Flight Controller - Dual-core STM32H7 with an array of sensors running the real-time estimation and control loop.

PROJECT: TVR - Thrust Vectored eVTOL Drone

Introduction:

A custom, coaxial thrust-vectored drone built as a technology demonstrator for guidance and control behind landable, reusable liquid rockets. Eventual goal being to develop a thrust vectored landable liquid rocket

TVR is now in its second design iteration. The vehicle flies on a coaxial pair of EMAX ECO III 2808 motors driving contra-rotating props, mounted in a two-axis gimballed cage actuated by Dynamixel servos, vectoring thrust in pitch and roll while using differential motor torque for yaw rather than the fixed-orientation rotors of a conventional multi-rotor. The photo shown in side is last year's vehicle.

This year's (2026/27) redesign keeps the same coaxial thrust-vectoring approach and rebuilds the electronics around a fully custom five-board avionics stack

Avionics:

Powered by a 6S LiPo pack, this year's airframe carries a five-board custom avionics stack: Flight controller, ESC, Sensor Board, backplane, and Jetson Carrier board, linked over a high-density board-to-board backplane. It's a ground-up in-house build spanning propulsion, power electronics, RF, and sensor integration and protection systems developed as a stepping stone toward more advanced actively-controlled vehicles.

Electromechanical Assembly: